Our high-performance cryogenic probe stations for on-wafer and multi-chip measurements support a wide range of challenging applications, including IR-sensor test, radiometric test, DC and RF measurements at cryogenic temperatures. The systems can handle wafers up to 300 mm, and support cold filter, cold shutter and selectable f/value aperture as well as multiple optical instruments like IR radiation sources (black bodies). Up to eight probe positioners and/or a probe card can be integrated. Automatic chip alignment, OCR and wafer mark reading are exclusive features of our fully- and semi-automated systems. Cooling options include liquid helium (LHe), liquid nitrogen (LN2) or cryogen-free cooling. With a large install base of >80 stations worldwide, we bring expertise and technical know-how to provide the right solution for your measurement challenge.
Our vacuum and pressure probe stations for on-wafer measurements in a high vacuum or controlled pressure environment enable precise µ-bolometer test (un-cooled IR-FPA), MEMS characterization (inertial MEMS, resonators and RF MEMS, pressure sensors), IV/CV, RF/mmW and Opto measurements. Multiple optical instruments like IR radiation sources (black bodies), and up to eight probe positioners and/or a probe card can be integrated. The high stability design provides excellent contact quality and accurate measurement results in a condensation-free test environment. Step and repeat capability enables high throughput with our semi-automated systems.